The Resource A novel entropy production based full-chip TSV fatigue analysis, by Tianchen Wang

A novel entropy production based full-chip TSV fatigue analysis, by Tianchen Wang

Label
A novel entropy production based full-chip TSV fatigue analysis
Title
A novel entropy production based full-chip TSV fatigue analysis
Statement of responsibility
by Tianchen Wang
Title variation
Novel entropy production based full-chip Through-silicon vias fatigue analysis
Creator
Author
Subject
Language
eng
Summary
"Through-silicon vias (TSVs) are subject to thermal fatigue due to stress over time, no matter how small the stress is. Existing works on TSV fatigue all rely on measurement-based parameters to estimate the lifetime, and cannot consider detailed thermal profiles. In this paper, we propose a new method for TSV fatigue prediction using entropy production during thermal cycles. By combining thermodynamics and mechanics laws, the fatigue process can be quantitatively evaluated with detailed thermal profiles. Experimental results show that interestingly, the landing pad possesses the most easy-to-fail region, which generates up to 50\% more entropy compared with the TSV body. The impact of landing pad dimension and TSV geometries are also studied, providing guidance for reliability enhancement. Finally, full-chip fatigue analysis is performed based on stress superposition. To the best of the authors' knowledge, this is the first TSV fatigue model that is free of measurement data fitting, the first that is capable of considering detailed thermal profiles, and the first framework for efficient full-chip TSV fatigue analysis."--Abstract, page iii
Member of
Cataloging source
UMR
http://library.link/vocab/creatorName
Wang, Tianchen
Degree
M.S.
Dissertation year
2015.
Granting institution
Missouri University of Science and Technology
Illustrations
illustrations
Index
no index present
Literary form
non fiction
Nature of contents
  • dictionaries
  • bibliography
  • theses
http://library.link/vocab/subjectName
  • Three-dimensional integrated circuits
  • Interconnects (Integrated circuit technology)
  • Metals
  • Entropy
Label
A novel entropy production based full-chip TSV fatigue analysis, by Tianchen Wang
Instantiates
Publication
Note
Vita
Bibliography note
Includes bibliographic references (pages 32-33)
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier.
Content category
text
Content type code
txt
Content type MARC source
rdacontent.
Control code
921182171
Extent
1 online resource (viii, 34 pages)
Form of item
online
Governing access note
These materials are protected under copyright by the original author
Media category
computer
Media MARC source
rdamedia.
Media type code
c
Other physical details
color illustrations.
Specific material designation
remote
System control number
(OCoLC)921182171
Label
A novel entropy production based full-chip TSV fatigue analysis, by Tianchen Wang
Publication
Note
Vita
Bibliography note
Includes bibliographic references (pages 32-33)
Carrier category
online resource
Carrier category code
cr
Carrier MARC source
rdacarrier.
Content category
text
Content type code
txt
Content type MARC source
rdacontent.
Control code
921182171
Extent
1 online resource (viii, 34 pages)
Form of item
online
Governing access note
These materials are protected under copyright by the original author
Media category
computer
Media MARC source
rdamedia.
Media type code
c
Other physical details
color illustrations.
Specific material designation
remote
System control number
(OCoLC)921182171

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