Coverart for item
The Resource Handbook of silicon based MEMS materials and technologies, Veikko Lindroos ... [et al.], (electronic resource)

Handbook of silicon based MEMS materials and technologies, Veikko Lindroos ... [et al.], (electronic resource)

Label
Handbook of silicon based MEMS materials and technologies
Title
Handbook of silicon based MEMS materials and technologies
Statement of responsibility
Veikko Lindroos ... [et al.]
Contributor
Subject
Language
eng
Summary
  • Annotation:
  • Annotation:
Member of
Cataloging source
CaPaEBR
LC call number
TK7875
LC item number
.H36 2010eb
http://library.link/vocab/relatedWorkOrContributorName
  • Lindroos, Veikko
  • ebrary, Inc
Series statement
Micro & nano technologies
http://library.link/vocab/subjectName
  • Microelectromechanical systems
  • Microelectromechanical systems
  • Silicon
Summary expansion
  • A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.Key topics covered include:Silicon as MEMS materialMaterial properties and measurement techniquesAnalytical methods used in materials characterizationModeling in MEMSMeasuring MEMSMicromachining technologies in MEMSEncapsulation of MEMS componentsEmerging process technologies, including ALD and porous siliconWritten by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.Veikko Lindroosis Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland.Markku Tilliis Senior Vice President of Research at Okmetic, Vantaa, Finland.Ari Lehtois Professor of Silicon Technology at Helsinki University of Technology, Finland.Teruaki Motookais Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
  • A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques . Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs . Discusses properties, preparation, and growth of silicon crystals and wafers . Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures
Label
Handbook of silicon based MEMS materials and technologies, Veikko Lindroos ... [et al.], (electronic resource)
Instantiates
Publication
Bibliography note
Includes bibliographical references and index
Control code
OCM1bookssj0000419278
Dimensions
unknown
Edition
1st ed.
Isbn
9780815515944
Isbn Type
(hbk.)
Specific material designation
remote
System control number
(WaSeSS)bookssj0000419278
Label
Handbook of silicon based MEMS materials and technologies, Veikko Lindroos ... [et al.], (electronic resource)
Publication
Bibliography note
Includes bibliographical references and index
Control code
OCM1bookssj0000419278
Dimensions
unknown
Edition
1st ed.
Isbn
9780815515944
Isbn Type
(hbk.)
Specific material designation
remote
System control number
(WaSeSS)bookssj0000419278

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